Apparatus and method for manufacturing semiconductor devices

ABSTRACT

In an apparatus for manufacturing semiconductor devices, a container is disposable on a load port and is adapted to accommodate one or more wafers. A transfer robot is installed at a frame and the frame is located between the load port and processing equipment. The transfer robot moves the one or more wafers between the processing equipment and the container. A gas supplying part blows a more desirable gas, e.g., a nitrogen gas or an inert gas, into the container through opening holes formed through a wall of the container. The more desirable gas flows (due to a pressure gradient) from the container to the frame to substantially (if not completely) prevent a less desirable gas (e.g., contaminated air) in the frame from entering the container as the one or more wafers are moved between the container and the processing chamber.

PRIORITY STATEMENT

This application claims the priority of Korean Patent Application No. 2005-61340, filed on Jul. 7, 2005, the disclosure of which is incorporated herein in its entirety by reference.

BACKGROUND

1. Field of the Invention

The present invention relates to an apparatus and a method for manufacturing semiconductor devices.

2. Discussion of the Related Art

As a semiconductor chip size and a circuit width become finer, contamination control is an increasingly important issue. In the past, a semiconductor manufacturing process had been carried out in a clean room where a relatively high level of clean environment was provided for the entire space of the clean room, and mostly an open type container had been used to accommodate or to carry wafers. However, more recent efforts to reduce costs maintain only a process chamber and some other chambers related to the process chamber in a higher level of cleanliness, while a lower level of cleanness is applied for other areas. As such, the more recent approach uses a closed type container as a replacement for the open type one in order that the wafers accommodated in the container are not contaminated in the areas of the lower level of cleanliness. A front open unified pod is a typical example of the closed type container.

With diameters of the wafer increasing from 200 mm to 300 mm, a wafer transfer system such as an equipment front end module (EFEM) is needed in front of a processing chamber to move the wafer from the container to the processing chamber. Referring to Related Art FIG. 1, wafer transfer system 1 includes a frame (or vestibule) 910 of which inside is maintained highly clean. Within the frame 910, are installed a robot 940 for transferring a wafer (W) from a container 920 to the processing chamber (not drawn) and a door actuator (not drawn) for closing or opening a door of the container 920. A blowing fan 952 and a filter 954 are installed on an upper side of the frame 910. The blowing fan 952 drives air flow from the upper side to a lower side within the frame 910, and the filter 954 removes contaminants in the air flow.

As is illustrated in FIG. 1, a portion of air residing in the frame 910 undesirably enters the container 920 while the wafer W is being transported between the container 920 and the process chamber. The air in the frame 910 includes contaminants. These contaminants may have been introduced by the air passing through the filter 954, or may be transported into the frame 910 from the process chamber (again, not drawn). The contaminants in the air that enters the container 920 cause harmful effects on the surface layer on the wafer W.

In addition, the air in the container 920 forms an oxidization layer on the surface of the wafer W, when the container 920 into which the wafer W is loaded is being transported for other process.

SUMMARY

At least one embodiment of the present invention provides a semiconductor device manufacturing apparatus.

At least one embodiment of the present invention provides a method for manufacturing a semiconductor device.

An embodiment of the present invention provides for a semiconductor device manufacturing apparatus includes: a load port on which a container is disposable, the container being adapted to accommodate one or more wafers; a frame, in which less desirable gas is present, located between the load port and processing equipment, the frame being adapted to accommodate a transfer robot that can move the one or more wafers between the processing equipment and the container on the load port; and a gas supplying part for supplying a more desirable gas into the container through an opening hole formed in a wall thereof such that the more desirable gas flows from the container toward the frame.

An embodiment of the present invention provides a method for manufacturing a semiconductor device using an apparatus having a load port on which a container is disposable and a frame positioned between the load port and processing equipment, container being adapted to accommodate one or more wafers, the frame being adapted to accommodate a robot to transfer a wafer between the load port and the processing equipment. Such a method comprises: supplying a more desirable gas into the container while the one or more wafers are transferred between the container and the processing equipment, wherein the more desirable gas is blown into the container through opening hole formed in a wall of the container such that the more desirable gas is maintained at a positive pressure relative to a less desirable gas in the frame.

Additional features and advantages of the present invention will be more fully apparent from the following detailed description of example embodiments, the accompanying drawings and the associated claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are intended to depict example embodiments of the present invention and should not be interpreted to limit the scope thereof. The accompanying drawings are not to be considered as drawn to scale unless explicitly noted.

The above and other advantages of the present invention will become readily apparent by reference to the following detailed description when considered in conjunction with accompanying drawings wherein:

FIG. 1 is a cross-sectional view illustrating a conventional apparatus for transporting a wafer between a container and a processing equipment;

FIG. 2 is a cross-sectional view illustrating a semiconductor device manufacturing apparatus according to an example embodiment of the present invention;

FIG. 3 is a cross-sectional view illustrating (according to an example embodiment of the present invention) a closing device installed in a container;

FIG. 4 is a schematic view illustrating (according to an example embodiment of the present invention) a closing device installed in a load port;

FIG. 5 is a cross-sectional view illustrating (according to an example embodiment of the present invention) a gas flow when a container is mounted on a load port; and

FIG. 6 is a flow chart illustrating a semiconductor device manufacturing method according to an example embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

It will be understood that if an element or layer is referred to as being “on,” “against,” “connected to” or “coupled to” another element or layer, then it can be directly on, against connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, if an element is referred to as being “directly on”, “directly connected to” or “directly coupled to” another element or layer, then there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, term such as “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, it should be understood that these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “includes” and/or “including”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Hereinafter, the embodiments of the present invention will be described below in more detail with reference to the accompanying drawings, FIG. 2 to FIG. 6. The present invention may, however, be embodied in different forms and should not be constructed as limited to the example embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

Hereinafter, the term wafer will be used in place of the term substrate. Obviously, one or more embodiments of the present invention will be equally valid for any type of the substrate other than wafer that includes one used for IC devices.

FIG. 2 is a drawing for illustrating rough features of a semiconductor device manufacturing apparatus 1′ according to an example embodiment of the present invention. The apparatus 1′ includes a wafer transfer system 40 for moving a wafer W between a container 20 and processing equipment 10. The container 20 includes a body 21 (see FIG. 3) that includes a space with an opening in the front; and a door 22 (see FIG. 3) for closing or opening the front opening of the space. For example, slots are formed on the inner wall of the container 21, and a portion of peripheral part of the wafer W is inserted into the slot. Such slots are formed in a layered structure such that the wafers W can be stacked. The front opening of the container 20 is closed by the door 22 when the container is being transferred for substantially (if not completely) preventing entry of outside air into the container. For example, a Front Open Unified Pod (FOUP) can be used for the container 20.

The wafer transfer system 40 is located in front of the processing equipment 10. The processing equipment 10 includes a load lock chamber (not shown) and a process chamber (not shown). The process chamber may be a chamber where processes such as chemical vapor deposition, etch, photo, measurements, cleansing, etc., are carried out.

The wafer transfer system 40 includes a load port 100 (on which the container 20 is mounted) and a frame (or vestibule) 200. The frame 200 is maintained at a relatively high level of cleanliness. For example, the wafer transfer system may be described as a type of an Equipment Front End Module (hereinafter, EFEM).

The load port 100 generally has a flat top surface, and is connected to the front of the frame 200. One or more of the load ports 100 can be provided. The container 20 is placed on the load port 100 by a transfer device (not shown). A device such as an overhead transfer (OHT), an overhead conveyor (OHC), an automatic guided vehicle (AGV), etc., can be the transfer device. The frame 200 is located between the processing equipment-10 and the load port 100.

One or more of robots 280 are installed within the frame 200. The robots move wafers (W) between the container 20 placed on the load port 100 and the processing equipment 10. The frame 200 is generally rectangular parallelepiped, and has an opening 242 on a rear face 240 of the frame 200 adjacent to the processing equipment 10. The opening 242 is a passageway for transferring the wafer W between the frame 200 and the processing equipment 10. Another opening 222 is formed on the front face 220 of the frame 200 adjacent to the load port 100. The opening 222 is a passageway for moving the wafers W between the container 20 and the frame 200. Inside of the frame 200 is installed a door actuator 290 in order to open or close a door 22 of the container 20. The door actuator 290 includes a door holder 292 and an arm 294. The door holder 292 is attached to the door 22 of the container 20 and detaches the door 22 from the container 20. The arm 294 is fixed to the door holder 292 and moves the door holder 292.

A fan filter unit 250 is installed on the top of the frame 200. The fan filter unit 250 includes a blowing fan 252 that is rotated by a motor (not drawn) and a filter 254 that is located below the blowing fan 252. The blowing fan 252 sucks air from outside and blows the air toward the bottom in the frame 200. The filter 254 removes contaminants from the air that is sucked into the frame 200. A discharge plate 270 is installed on a bottom surface of the frame 200. Holes for evacuating the air from the frame 200 to outside are formed on its surface of the discharge plate 270.

When the container 20 is mounted on the load port 100, the door 22 is opened by the door actuator 290. A wafer W in the container 20 is moved to the processing equipment 10 by a transfer robot 280, and the wafer W, after due process in the processing equipment 10, is moved back to the container 20 by the transfer robot 280. When all of the wafers W are moved back into the container 20, the door 22 is closed by the door actuator 290. Various kinds of contaminants may exist in the frame 200. For example, these may be molecule-sized contaminants that entered the frame 200 with airflow, passing through the filter pan unit 250, or may be contaminants transported into the frame 200 from the processing equipment 10 through the passage opening 242. The contaminants existing in the frame 200 can enter the inside of the container 20, when the door 22 of the container 20 (placed on the load port 100) is opened. These contaminants cause harmful effects on the surface layer on the wafer W, and form an oxidization layer on the surface of the wafer W, e.g., subsequently as the container 20 is being transported with the door 22 closed.

In order to substantially (if not completely) prevent these harmful effects, a gas supplying part 300 (see FIG. 4) is provided to the wafer transfer system 40. The gas supplying part 300 is to supply nitrogen or inert gas into the container 20. Hereinafter, the nitrogen gas or inert gas will be denoted simply as gas. The gas supplying part 300 blows the gas into the container 20 through opening holes 24 that (see FIG. 3) are formed on the wall of the body 21 (see FIG. 3)A positive pressure is created in the container 20 (relative to pressure in the frame 200) by the gas supplying part 300. As a result, the gas supplied into the container 20 flows from the container 20 toward the frame 200, so the air mass of the frame 200 substantially (if not completely) can be prevented from entering the container 20.

For example, the gas supplying part 300 supplies continuously the gas into the container 20, while the door 22 of the container 20 is open. The gas supplying part 300 starts to supply the gas into the container 20 before the door 22 of the container 20 is opened, and stops the gas supply after processing is completed and the door 22 of the container 20 is closed. As a more particular example, the gas supplying part 300 starts to blow the gas into the container 20 when the container 20 is mounted on the load port 100, and stops blowing when the container 20 is moved from the load port 100.

Hereinafter, an explanation will be given for an example of structure for supplying the gas into the container 20 from the gas supplying part 300. FIG. 3 is a drawing for roughly illustrating (according to an example embodiment of the present invention) an internal structure of the container 20, and FIG. 4 roughly shows (according to an example embodiment of the present invention) a structure of the load port 100. The opening hole 24 is formed on the bottom wall 21 a of the body 21. The gas supplying part 300 is provided to, e.g., is incorporated as a part of, the load port 100. One or more of opening holes 24 are formed on the peripheral region of the bottom wall 21 a such that, e.g., the gas flow may not hit wafers W in the container 20 directly. The opening holes 24 can be formed on each corner of the bottom wall 21 a of the container 20.

The opening holes 24 are controlled by valves that default to closed state such that the inside of the container 20 is isolated from outside, when the container 20 is transferred. Such valves are referred to as closing devices 400 (see FIG. 3).

The closing device 400 includes a support plate 440, an elastic member 460, a blocking plate 480, and protrusions 490 (see FIG. 4). The support plate 440, the elastic member 460, and the blocking plate 480 are installed on the container 20, while the protrusions 490 are installed on the load port 100. A plurality of support rods 420 are placed, being separated in a distance from one another, around the opening holes 24 on the bottom wall 21 a of the body 21. The support rods 420 stand vertically (normally) toward the inside of the body 21 on the bottom wall 21 a of the body 21. The support plate 440 is fixed on the top edge of the support rods 420. The support plate 440 is positioned to face the opening hole 24. Between the support plate 400 and the opening hole 24 is positioned the blocking plate 480, the blocking plate 480 facing the opening hole 24.

The area of the blocking plate 480 is larger than that of the opening hole 24, so the peripheral area of the blocking plate 480 can be in tight contact with the area that surrounds the opening hole 24. The blocking plate 480 is connected to the support plate 440 by the elastic bodies 460, e.g., springs. One end of the spring 460 abuts the blocking plate 480, while the other end of the spring 460 abuts the support plate 440. The spring 460 between the blocking plate 480 and the support plate 400 is installed in a compressed state such that the blocking plate 480 keeps in contact with, hence closing, the opening hole 24 by elastic force of the spring 460 without any external forces applied.

The protrusions 490 are formed on the top surface of the load port 100. The protrusions 490 protrude above the top surface of the load port 100. The number of the protrusions 490 can be the same with that of the opening holes 24 and locations of the protrusions 490 correspond to the locations of the opening holes 24 when the container 20 is disposed on the load port 100. When the container 20 is disposed on the load port 100, the protrusion 490 presses the blocking plate 480. The spring 460 is further compressed, and the blocking plate 480 is disengaged from the bottom wall 21 a of the body 21. The protrusion 490 is long enough that it can penetrate to a sufficient depth inside of the wall 21 so as to displace blocking plate 480 sufficiently to facilitate an appropriate amount of gas flow.

A gas line 320 is installed in the load port 100. The gas line 320 delivers the gas to the container 20. The gas is supplied to the gas line 320 through a supply line 340 from an outside reservoir (not drawn). A valve 342 is installed on the supply line 340 to control the flow rate or open/close the passage. An electrically controlled valve can be used for the valve. One or more of injecting holes 492 are formed on the sidewall of the protrusion 490, and the gas line 330 is connected to the injecting holes 492 on the protrusion 490. The gas that is supplied through the supply line 340 and the gas line 320 is blown through the injecting holes 492 and into the container 20 via the closing devices 400. The injecting holes 492 are formed on a portion of the sidewall of the protrusion 490. The portion is inserted into inside of the container 20.

A sensor 520 (see FIG. 4) is installed on the load port 100. The sensor 100 detects whether the container 20 is mounted on the load port 100 and sends a detect signal to a controller 540. Various kinds of sensor such as a pressure sensor, a light sensor, etc., can be used for the sensor 520. The controller 540 receives the detect signal, and manipulates the valve 342 installed on the supply line 340. If the sensor 520 detects the container 20 on the load port 100, then the controller 540 opens the valve 342 such that the gas can be supplied through the gas line 320. If the sensor 520 doesn't detect the container 20 on the load port 100, then the controller 540 closes the valve 342, thereby stopping the gas supply from the gas line 320.

A sufficient amount of the gas is supplied to the container 20 so that the pressure at the container 20 is maintained higher than that of the frame 200. This ensures that air residing in the frame 200 does not enter the chamber 20. In addition, the gas is substantially (if not completely) prevented from being blown into the container 20 until the door 22 is closed, such that the container 20 is filled with nitrogen or inert gas. This substantially (if not completely) prevents the formation of an oxidization layer on the surface of the wafer W that is accommodated in the container 20, while the container 20 is being transferred to other equipment.

FIG. 5 is a drawing for illustrating (according to an example embodiment of the present invention) a gas flow pattern when the container 20 is disposed on the load port 100. As the container 20 is disposed on the load port 100, the protrusions 490 are inserted into the inside of the container 20 and received in the opening holes 24. The gas supplied through the gas line 320 is blown into the container 20 through the injecting holes 492 on the protrusion 490. A portion of the gas rises along the inner wall of the wafers W and flows through the gaps between the wafers W toward the frame 200. Consequently, the direction of the gas flow is set to be toward the frame 200 in the boundaries between the container 20 and the frame 200, hence substantially (if not completely) preventing the air mass in the frame 200 from moving into the container 20.

Hereinafter, the operating steps of the apparatus of the present invention will be explained with a reference to FIG. 6. FIG. 6 is a flow chart illustrating a semiconductor device manufacturing method according to an example embodiment of the present invention.

Initially the opening hole 24 of the container 20 is kept closed by the blocking plate 480 before the container 20 is disposed on the load port 100. The container 20 is disposed on the load port 100 by a transport device (step S10). As the container 20 is disposed on the load port 100 by the transport device, the protrusions 490 are received into the inside of the container 20 via the opening holes 24. At this point, the sensor 520 detects the container 20 on the load port 100, and sends the detect signal to the controller 540. The controller 520 opens the valve 342 such that nitrogen or inert gas is supplied through the gas line 320. The pressure of the container 20 is maintained higher than that of the frame 200 (step S20).

Then, the door 22 of the container 20 is opened, so the wall 21 of the container 20 is open in the front (step S30). The direction of the gas flow in the container 20 is toward the frame 200 to substantially (if not completely) prevent the air in the frame 200 from entering the container 20. The wafers W in the container 20 are moved to the processing equipment 10 by the transfer robot 280, and processing is carried out for each wafer in the processing chamber 10. After the respective processing is completed, each wafer W is moved back to the container 20 by the transfer robot 280 (step S40). When the processing is finished for all of the wafers W in the container 20, the door 22 is closed (step S50).

With the inside of the container 20 being filled with nitrogen or inert gas, the container 20 is transferred to the other process equipment 10. When the container 20 is moved away from the load port 100, the blocking plate 480 is driven by the elastic force back to tight contact with the bottom wall 21 a of the container 20, thereby closing the opening holes 24. The sensor 520 detects that the container 20 is moved away from the load port 100, and sends a corresponding signal to the controller 540. The controller 540 closes the valve 342, hence stopping the gas supply through the gas line 320 (step S60).

Although the present invention has been described in connection with the example embodiments thereof illustrated in the accompanying drawings, it is not limited thereto. It will be apparent to those skilled in the art that various substitution, modifications and changes may be thereto without departing from the scope and spirit of the present invention. 

1. A semiconductor device manufacturing apparatus comprising: a load port on which a container is disposable, the container being adapted to accommodate one or more wafers; a frame, in which less desirable gas is present, located between the load port and processing equipment, the frame being adapted to accommodate a transfer robot that can move the one or more wafers between the processing equipment and the container on the load port; and a gas supplying part for supplying a more desirable gas into the container through an opening hole formed in a wall thereof such that the more desirable gas flows from the container toward the frame.
 2. The semiconductor device manufacturing apparatus of claim 1, wherein the opening hole is formed through a bottom wall of the container, and the gas supplying part includes a gas line for supplying the more desirable gas through the opening hole of the container mounted on the load port, the gas line being installed within the load port.
 3. The semiconductor device manufacturing apparatus of claim 2, further comprising a closing device for closing or opening the opening hole of the container, wherein the closing device comprises: a support plate installed on the container; a blocking plate installed on the container to open or close the opening hole; an elastic member for connecting the support plate and the blocking plate such that the blocking plate closes the opening hole of the container by an elastic force from the elastic body; and a protrusion formed on the load port, the protrusion for being arranged to displace the blocking plate allowing the opening hole to be open when the container is mounted on the load port.
 4. The semiconductor device manufacturing apparatus of claim 3, wherein an injecting hole is formed through a portion of a sidewall of the protrusion, the portion is insertable into the container when the container is disposed on the load port, and the gas line is connected to the injecting hole.
 5. The semiconductor device manufacturing apparatus of claim 2, wherein the container comprises a body that provides a space with a front opening into which the wafers are received, and the semiconductor manufacturing apparatus further comprises a door actuator installed in the frame and a door for closing or opening the front opening of the body by the door actuator.
 6. The semiconductor device manufacturing apparatus of claim 2, further comprising: a sensor for detecting whether the container is disposed on the load port; and a controller for opening or closing a valve on the gas line through which the more desirable gas is supplied in response to a signal from the sensor.
 7. The semiconductor device manufacturing apparatus of claim 2, wherein one or more opening holes are formed through a peripheral region of the bottom wall.
 8. A method for manufacturing a semiconductor device using an apparatus having a load port on which a container is disposable and a frame positioned between the load port and processing equipment, the container being adapted to accommodate one or more wafers and the frame being adapted to accommodate a robot to transfer a wafer between the load port and the processing equipment, the method comprising: supplying a more desirable gas into the container while the one or more wafers is transferred between the container and the processing equipment, wherein the more desirable gas is blown into the container through opening hole formed in a wall of the container such that the more desirable gas is maintained at a positive pressure relative to a less desirable gas in the frame.
 9. The method of claim 8, further comprising: starting a flow of the more desirable gas into the container before a door of the container is opened; and stopping the flow of the more desirable gas after the door of the container is closed.
 10. The method of claim 8, wherein the opening hole is formed through a bottom wall of the container.
 11. The method of claim 10, wherein the container includes a blocking plate for opening and closing the opening hole, the opening hole is closed by the blocking plate due to an elastic force of an elastic member coupled to the blocking plate before the container is disposed on the load port or after the container is moved from the load port, the opening hole is open when the container is disposed on the load port due to the blocking plate pushed by protrusions formed on the load port, and the gas line for blowing the nitrogen gas or the inert gas into the container are installed in the load port.
 12. A method for manufacturing a semiconductor device using an apparatus having a load port on which a container is disposed and a frame positioned between the load port and a processing equipment, the container being adapted to accommodate one or more wafers and the frame being adapted to accommodate a robot to transfer the one or more wafers between the load port and the processing equipment, the method comprising: starting a flow of a more desirable gas into the container; opening a door of the container; transferring the one or more wafers between the container and the processing equipment using the robot; closing the door of the container; and stopping the flow of the more desirable gas into the container; wherein the more desirable gas is supplied to the container via one or more opening holes formed in the container such that the more desirable gas flows from the container to the frame so as to at least substantially prevent less desirable gas in the frame from entering the container.
 13. The method of claim 12, further comprising detecting whether the container is disposed on the load port.
 14. The method of claim 13, wherein the starting of the flow of the more desirable gas into the container is carried out after the container is disposed on the load port.
 15. The method of claim 13, wherein the stopping of the flow of the more desirable gas into the container is carried out after the container is removed from the load port.
 16. The method of claim 12, wherein the one or more opening holes are formed through a bottom wall of the container.
 17. The method of claim 16, wherein the container includes a blocking plate for opening and closing a corresponding instance of the one or more opening holes, the opening hole is closed by the blocking plate due to an elastic force of an elastic member coupled to the blocking plate before the container is mounted on the load port or after the container is moved from the load port, the opening hole is open when the container is mounted on the load port due to the blocking plate pushed by protrusion formed on the load port, and the gas line for blowing the nitrogen gas or the inert gas into the container are installed in the load port.
 18. The method of claim 17, wherein an injecting hole is formed through a portion of a sidewall of the protrusion, the portion is insertable into the container when the container is disposed on the load port, and the gas line is connected to the injecting hole.
 19. The method of claim 12, wherein the one or more opening holes are formed through a peripheral region of the bottom wall.
 20. The semiconductor device manufacturing apparatus of claim 1, wherein the more desirable gas includes at least one of substantially contaminant-free nitrogen gas and substantially contaminant-free inert gas.
 21. The method of claim 8, wherein the more desirable gas includes at least one of substantially contaminant-free nitrogen gas and substantially contaminant-free inert gas.
 22. The method of claim 12, wherein the more desirable gas includes at least one of substantially contaminant-free nitrogen gas and substantially contaminant-free inert gas. 